View ZSSC3036CI1BH_8178035.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

data sheet rev. 1 . 2 0 / may 20 1 3 zssc30 3 6 low - power, high - resolution 16 - b it sensor signal conditioner mobile sensing ics smart and mobile
z ssc3036 low - power 16 - bit sensor signal conditioner ic ? 201 3 zentrum mikroelektronik dresden ag rev. 1.20 may 28 , 2013. a ll rights reserved. the material c o ntained herein may not be reproduced, a dapted, merged, translated, stored, or used without the prior written consent of the copyright owner. the information furnished in this publication is su bject to changes without notice. for more information, contact zmdi via mobile.sensing@zmdi.com . brief description the zssc 3036 is a sensor signal conditioner (ssc) integrated circuit for high - accuracy ampli fication and analog - to - digital conversio n of a differ ential input signal. designed for high - resolution altimeter module applications, the zssc 3036 can perform offset, span, and 1 st and 2 nd order temperature compen - sation of the measured signal. developed f or correc - tion of resistive bridge sensors, it can also provide a corrected temperature output measured with an internal sensor. the measured and corrected bridge values are provided at the digital output pins, which can be configured as i 2 c ? * ( 3.4mhz) o r spi ( 20mhz). digital compensation of signal offset, sensitivity, temperature, and non - linearity is accomplished via an 18 - bit internal digital signal processor (dsp) run - ning a correction algorithm. calibration coeffici ents are stored on - chip in a high ly reliable, non - volatile, multi ple - time programmable (mtp) mem ory. pro - gramming the zssc 3036 is simple via the serial interface. the ic - internal charge pump provides the mtp programming voltage. the interface is used for the pc - controlled cali bration proc edure, which pro - grams the set of cali bration coefficients in memory. the zssc3036 provides accelerated signal process - ing in order to support high - speed control, safety , and real - time sensing applications . it complements zmdis additional zssc30 x 6 product s . features ? flexible, programmable analog front - end design; up to 16 - bit scalable, charge - balancing two - segment analog - to - digital converter (adc) ? fully programmable gain amplifier accepting sensors from 14 to 72 (linear factor) ? internal auto - compensated t emperature sensor ? digital compensation of individual sensor offset; 1 st and 2 nd order digital compensation of sensor gain as well as of 1 st and 2 nd order tem perature gain and offset drift ? fast sensing: 16 - bit conditioned sensor signal measure ment rate at m ore than 200s - 1 ? typical sensor elements can achieve accuracy of less than 0. 1 0% fso ** @ - 40 to 110 c benefits ? integrated 18 - bit calibration math dsp ? fully corrected signal at digital output ? layout customized for die - die bonding with sensor for high - dens ity chip - on - board assembly ? o ne - pass calibration minimizes calibration costs ? no external trimming , filter , or buffering com - ponents required ? highly integrated cmos design ? excellent for low - voltage and low - power battery applications ? optimized for operation in calibrated resistive sensor modules physical characteristics ? supply voltage range: 1.8 to 3.6v ? current consumptio n : 1m a ( operating mode) ? sleep state current : 5 0n a ( typical ) ? temperature resolution: < 0.00 3 k /lsb ? oper ation temperatures: C 40c to +85 c C 4 0c to +11 0 c ? small die size: 1.5mm2 ? delivery options: die for wafer bonding * i 2 c? is a trademark of nxp. ** fso = full scale output . zssc 3036 application exa mple
z ssc3036 low - power 16 - bit sensor signal conditioner ic ? 201 3 zentrum mikroelektronik dresden ag rev. 1.20 may 28, 20 13 . all rights reserved. the material c o ntained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. applications ? barometric altitude measurement for portable navigation or emergency call systems ? altitude measurement for car navigation ? inside hard disk pressure measurement ? weather forecast ? fan control ? industrial, pneumatic , and liquid pressure ? high - resolution temperature measurements zssc3036 block diagram ordering information (see sec tio n 6 in the data sheet for additional options for delivery package and wafer thickness of 725m .) sales code description delivery package zssc3036cc1b die t emperature range: C 40c to +85 c wafer (304m) unsawn, tested zssc3036ci1b die temperature range: C 40c to +85 c, e xtended qualification wafer (304m) unsawn, tested zssc3036cc1c die temperature range: C 40c to +85 c dice on frame (304 m) , tested zssc3036ci 1bh die temperature range: C 40c to +110 c , e xtended qualification wafer ( 304m) unsawn, tested zssc3036ci 1ch die temperature range: C 40c to +110 c , e xtended qualification dice on frame (304m), tested zssc30x6 - kit evaluation kit for zssc30x6 product family, including boards, cable, software, and 1 sample sales and further information www.zmdi.com mobile.sensing@zmdi.com zentrum mikroelektronik dresden ag global headquarters grenzstrasse 28 01109 dresden, germany central office: phone +49.351 .8822.0 fax +49.351.8822.600 zmd america, inc. 1525 mccarthy blvd., #212 milpitas, ca 95035 - 7453 usa usa phone +855.275.9634 zentrum mikroelektronik dresden ag, japan office 2nd floor, shinbashi tokyu bldg. 4 - 21 - 3, shinbashi, minato - ku tokyo, 105 - 0004 japa n zmd far east, ltd. 3f, no. 51, sec. 2, keelung road 11052 taipei taiwan zentrum mikroelektronik dresden ag, korea office u - space 1 building 11th floor, unit ja - 1102 670 sampyeong - dong bundang - gu, seongnam - si gyeonggi - do, 463 - 400 korea phone +82.31.950. 7679 fax +82.504.841.3026 phone +408.883.6310 fax +408.883.6358 phone +81.3.6895.7410 fax +81.3.6895.7301 phone +886.2.2377.8189 fax +886.2.2377.8199 european technical support phone +49.351.8822.7.772 fax +49.351.8822.87.772 disclaimer : this informa tion applies to a product under development. its characteristics and specifications are subject to change without notice. zentrum mikroelek tronik dresden ag (zmd ag) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. the information furnished hereby is believed to be true and accurate. however, under no circumstances shall zmd ag be liable to a ny customer, licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or in any way related to the furnishing, performance, or use of this technical data. zmd ag hereby expressly disclaims any liabi lity of zmd ag to any customer, licensee or any other third party, and any such customer, lice nsee and any other third party hereby waives any liability of zmd ag for any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty, tort (including negligence), strict li ability, or otherwise. european sales (stuttgart) phone +49.711.674517.55 fax +49.711.674517.87955 s e n s o r b r i d g e a g n d / c m g e n e r a t o r b i a s c u r r e n t g e n e r a t o r p o w e r - o n r e s e t t e m p e r a t u r e r e f e r e n c e s e n s o r 1 8 - b i t d s p c o r e ( c a l c u l a t i o n s , c o m m u n i c a t i o n ) m t p r o m s y s t e m c o n t r o l u n i t m u l t i p l e x e r p r e - a m p l i f i e r v t p v t n e o c i n p i n n v d d v s s b r i n g o s c i l l a t o r c l o c k g e n e r a t o r s e l s p i i 2 c t m s c l k / s c l m i s o m o s i / s d a s s v s s v o l t a g e r e g u l a t o r p o w e r c t r . v r e g i n t a d 1 6 b i t v d d b z s s c 3 0 3 6
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 4 of 49 table of contents 1 ic characteristics ................................ ................................ ................................ ................................ .......... 7 1.1. absolute maximum ratings ................................ ................................ ................................ .................... 7 1.2. operating conditio ns ................................ ................................ ................................ .............................. 7 1.3. electrical parameters ................................ ................................ ................................ ............................. 8 1.4. power supply rejection ratio (rsrr) vs. frequency ................................ ................................ ......... 10 2 circuit description ................................ ................................ ................................ ................................ ....... 11 2.1. brief description ................................ ................................ ................................ ................................ ... 11 2.2. signal flow and block diagram ................................ ................................ ................................ ............ 11 2.3. analog front end ................................ ................................ ................................ ................................ .. 12 2.3.1. amplifier ................................ ................................ ................................ ................................ ......... 12 2.3.2. analog - to - digital converter ................................ ................................ ................................ ............ 14 2.3.3. temperature measurement ................................ ................................ ................................ ........... 18 2.3.4. bridge supply ................................ ................................ ................................ ................................ . 18 2.4. digital section ................................ ................................ ................................ ................................ ....... 18 2.4.1. digital signal processor (dsp) core ................................ ................................ ............................. 18 2.4.2. mtp memory ................................ ................................ ................................ ................................ .. 18 2.4.3. clock generator ................................ ................................ ................................ ............................. 19 2.4.4. power supervision ................................ ................................ ................................ ......................... 19 2.4.5. interface ................................ ................................ ................................ ................................ ......... 19 3 functional description ................................ ................................ ................................ ................................ . 20 3.1. power up ................................ ................................ ................................ ................................ .............. 20 3.2. measurements ................................ ................................ ................................ ................................ ...... 20 3.3. operational modes ................................ ................................ ................................ ............................... 21 3.4. command interpretation ................................ ................................ ................................ ....................... 23 3.4.1. spi/i 2 c? commands ................................ ................................ ................................ .................... 23 3.5. communication interface ................................ ................................ ................................ ...................... 26 3.5.1. common functionality ................................ ................................ ................................ ................... 26 3.5.2. spi ................................ ................................ ................................ ................................ ................. 27 3.5.3. i 2 c? ................................ ................................ ................................ ................................ ............... 30 3.6. memory ................................ ................................ ................................ ................................ ................. 31 3.6.1. programming memory ................................ ................................ ................................ ................... 31 3.6.2. memory status commands ................................ ................................ ................................ ........... 32 3.6.3. memory contents ................................ ................................ ................................ ........................... 33
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 5 of 49 3.7. calibration sequence ................................ ................................ ................................ ........................... 39 3.7.1. calibration step 1 C assigning unique identification ................................ ................................ ..... 40 3.7.2. calibration step 2 C data collection ................................ ................................ .............................. 40 3.7.3. calibration step 3 C coefficient calculations ................................ ................................ ................. 41 3.8. the calibration math ................................ ................................ ................................ ............................ 41 3.8.1. bridge signal compen sation ................................ ................................ ................................ ......... 41 3.8.2. temperature signal compensation ................................ ................................ ............................... 44 4 die dimensions and pad assignments ................................ ................................ ................................ ....... 45 5 quality and reliability ................................ ................................ ................................ ................................ .. 46 6 ordering sales codes ................................ ................................ ................................ ................................ . 47 7 related documents ................................ ................................ ................................ ................................ ..... 47 8 glossary ................................ ................................ ................................ ................................ ...................... 48 9 document revision history ................................ ................................ ................................ ......................... 49 table of figures figure 2.1 zssc3036 functional block diagram ................................ ................................ ........................... 1 1 figure 2.2 adc offset ................................ ................................ ................................ ................................ ..... 17 figure 3.1 operational flow chart: power up ................................ ................................ ................................ 22 figure 3.2 operational flow chart: command mode and normal mode ................................ ....................... 23 figure 3.3 spi configuration cpha=0 ................................ ................................ ................................ ........... 27 figure 3.4 spi co nfiguration cpha=1 ................................ ................................ ................................ ........... 28 figure 3.5 spi command request ................................ ................................ ................................ ................. 28 figure 3.6 spi read status ................................ ................................ ................................ ............................ 29 figure 3.7 spi read data ................................ ................................ ................................ ............................... 29 figure 3.8 i 2 c? command reque st ................................ ................................ ................................ .............. 30 figure 3.9 i 2 c? read status ................................ ................................ ................................ .......................... 30 figure 3.10 i 2 c? read data ................................ ................................ ................................ ............................ 31 figure 3.11 memory program operation ................................ ................................ ................................ .......... 32 figure 4.1 zssc30 36 pad placement ................................ ................................ ................................ ............ 45 list of tables table 1.1 maximum ratings ................................ ................................ ................................ ............................ 7 table 1.2 operating conditions ................................ ................................ ................................ ....................... 7 table 1.3 requirements for vdd power - on reset ................................ ................................ .......................... 8 table 1.4 electrical parameters ................................ ................................ ................................ ....................... 8 table 2.1 amplifier gain: stage 1 ................................ ................................ ................................ .................. 12
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 6 of 49 table 2.2 amplifier gain: stage 2 ................................ ................................ ................................ .................. 13 table 2.3 gain polarity ................................ ................................ ................................ ................................ .. 13 table 2.4 msb/lsb segmentatio n settings for bridge measurement ................................ .......................... 14 table 2.5 msb/lsb segmentation settings for temperature measurement ................................ ................ 14 table 2.6 adc conversion times for a single a2d conversion ................................ ................................ ... 15 table 2.7 typical conversion times vs. noise performance for 16 - bit results with full sensor signal conditioning for azbm, bm, aztm, and tm ................................ ................................ ................. 16 table 2.8 adc offset settings ................................ ................................ ................................ ....................... 17 table 3.1 spi/i 2 c? commands ................................ ................................ ................................ .................... 24 table 3.2 get_raw commands ................................ ................................ ................................ .................... 25 table 3.3 general status byte ................................ ................................ ................................ ....................... 26 table 3.4 status byte for read operations ................................ ................................ ................................ ... 26 table 3.5 s tatus byte for write operations ................................ ................................ ................................ ... 26 table 3.6 mode status ................................ ................................ ................................ ................................ ... 27 table 3.7 memory status word ................................ ................................ ................................ ..................... 32 table 3.8 mtp memory content assignments ................................ ................................ .............................. 33 table 4.1 die size & geometry ................................ ................................ ................................ ..................... 46 table 4.2 pin assignments ................................ ................................ ................................ ............................ 46
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 7 of 49 1 ic characteristics 1.1. absolute maximum ratings note: the absolute maximum ratings are stress ratings only. the zssc3036 might not function or be operable above the recommended o perating conditions. stresses exceeding the absolute maximum ratings might also damage the device. in addition, extended exposure to stresses above the recommended operating conditions might affect device reliability. zmdi does not recommend designing to t he absolute maximum ratings. table 1 . 1 maximum ratings parameter symbol min typ max units voltage reference vss 0 0 v analog supply voltage v dd - 0. 4 3.63 v voltage at all a nalog and d igital io pins v a_i o , v d_io - 0. 5 v dd +0. 5 v input c urrent into any p in e xcept sda, clk 1) and s upply p ins 2) i in - 10 0 100 ma electrostatic d ischarge tolerance C human body model (hbm 1) 3) v hbm 1 4 000 - v storage t emperature t stor - 50 125 c 1) latch - up current limit for clk/sclk and mosi/sda : 70ma . 2) latch - up resistance; reference for pin is 0v. 3) hbm1: c = 100pf charged to v hbm1 with resist or r = 1.5k ? in series based on mil 883, method 3015.7. esd protection referring to the human body model is tested with devices in ceramic dual in - line packages (cdip) during product qualification. 1.2. operating conditions the r eference for all voltages is vss. table 1 . 2 operating conditions parameter symbol min typ max unit s upply v oltage v dd 1.8 - 3.6 v vdd rise time t vdd 200 s bridge current 1) i vddb 1.8 m a 16.5 operation temperature range standard t amb - 40 - 85 c operation temperature range -- extended 2) - 40 - 110 c e xternal capacitance between vddb and vss cl 0.01 50 nf 1) p ower supply rejection is reduced if a current in the range of 16.5ma > i vddb > 1.8ma is drawn out of vddb. 2) extended temperature range is indicated by the addition of h to the part number.
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 8 of 49 a dynamic power - on - reset cir cuit is implemented in order to achieve minimum current consumption in idle mode . the vdd low level and the subsequent rise time and vdd rising slope must meet the requirements in table 1 . 1 to guarantee an overall ic reset: lower vdd low levels allow slower rising of the subsequent on - ramp of vdd. other combinations m ight also be possible. for example, t he reset trigger can be inf luenced by increasing the power - down time and lowering the vdd rising slope requirement . table 1 . 3 requirements for vdd power - on reset parameter symbol min typ max unit power down time (duration of vdd low level) t spike 3 - - s vdd low level vdd low 0 - 0.2 v vdd rising slope sr vdd 10 - - v/m s 1.3. electrical parameters all parameter values are valid only under the specified operating conditions. all v oltages are referenced to vss. table 1 . 4 electrical parameters note: see important table notes at the end of the table. parameter symbol conditions/comments min typ max unit supply b ridge s upply v oltage, adc r eference v oltage v ddb i nternally generated 1.6 0 1. 67 1.7 4 v current consumption i vdd active state, average 900 1500 a sleep state, idle c urrent , ? 85c 20 250 n a sleep state, idle current , ? 1 10 c 50 9 5 0 na power supply rejection 20 log 10 (v dd /v ddb ) (see section 1.4 ) psr vdd v dd = 1.8v 17 db v dd = 2v 3 2 db m emory p rogram v oltage v dd,p rog required voltage level at vdd pin 2.9 3.6 v mean p rogram c urrent i vdd, p rog mean current consumption during mtp programming cycle at vdd 6 ma peak program current i prog, max mtp program at v dd - pin , dynamic switch - on current draw 20 ma
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 9 of 49 parameter symbol conditions/comments min typ max unit analog - to - digital converter (adc , a2d ) resolution r adc 10 16 bit adc c lock f requency f adc internal adc clock 1.8 2 2.2 mhz r eference v oltage n v refn v ddb * 0.03 r eference v oltage p v refp v ddb * 0.97 o ffset a2d_offset 8 - step programmable offset 1/16 8/16 integral nonlinearity (inl) inl adc b ased on ideal slope - 4 - +4 lsb differential nonlinearity dnl adc t ested / verified within design - 1 - +1 lsb conversion rate, 16 - b it s ingle f s ,raw conversion s per second for single 16 - bit a2d conversion 20 - 1 350 hz amplifier gain g amp 32 steps 13.2 72 gain error g err referenced to nominal gain - 1.5 - 1.5 % sensor signal conditioning performance ic accuracy error 1) err a,ic accuracy error for ideally linear ( in temperature and measurand ) sensor 0. 0 1 % fso conversion rate, 16 - b it ssc f s, ssc conversion per second for fully corrected 16 - bit measurement 5 325 hz input input voltage range v inp , v inn input voltage range at inp and inn 0.65 1.05 v bridge resi stance r br f ull power supply disturbance rejection ( psrr ) capabilities 1 10 50 k r educed psrr, but full functionality 100 999 power - up start - up time t sta1 v dd ramp up to interface communication (see section 3.1 ) 1 ms t sta2 v dd ramp up to analog operation 2.5 ms wake - up time t wup1 sleep to active state interface communication 0.5 ms t wup2 sleep to active state analog operation 2 ms oscillator internal oscillator frequency f clk 3. 6 4 4. 4 m hz
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 10 of 49 parameter symbol conditions/comments min typ max unit internal temperature sensor temperature resolution f or both temperature range s : - 40c to +85c - 40c to + 110 c 0.003 k/lsb interface and memory spi clock frequency f c,spi maximum capacitance at miso line: 40pf @ v dd =1.8v 20 mhz i2c ? clock fr equency f c,i2c 3.4 mhz program time t prog mtp programming time per 16 - bit register 500 600 s data retention 2) t ret_mtp 1000h @ 1 25 c 10 a 1) percentage referred to maximum f ull - scale output (fso); e.g. for 16 - bit measurements: err a,ic [%fso] = 100 max{ | adc meas C adc ideal | } / 2 16 . 2) with maximum ambient temperature of 125c. 1.4. power supply rejection ratio (rsrr) vs. frequency
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 11 of 49 2 c ircuit description 2.1. brief description the z ssc 3036 provides a highly accurate amplification of bridge sensor signals. the compensation of sensor offset, sensitivity, temperature drift, and non - linearity is accomplished via an 18 - bit dsp core running a correction algorithm with calibration coefficie nts stored in an mtp memory. the zssc 3036 can be configured for a wide range of resistive bridge sensor types. a digital interface (spi or i 2 c ? ) enables communication. the zssc 3036 supports two operational modes: no rmal m ode and c om mand m ode. normal m ode i s the standard operating mode. typically in normal mode, the zssc3036 wakes up from a s leep s tate (low power) , runs a measurement in a ctive s tate , and automatically returns to the sleep s tate . (see section 3.3 f or details on operational modes.) 2.2. signal flow and block diagram see figure 2 . 1 for the zssc 3036 block diagram. the sensor bridge supply v ddb and the power supply for analog circuitry are provided by a voltage regul ator , which is optimized for power supply disturbance rejection (psrr). see section 1.4 for a graph of psrr versus frequency. to improve noise suppression, the digital blocks are powered by a separate voltage re gulator. a power supervision circuit monitors all supply voltage s and generates appropriate reset signals for initializing the digital blocks. the state machine controls the analog circuitry to perform the three measurement types: bridge, temperature, and offset measurement. the multiplexer selects the signal input to the amplifier, which can be the external signals from the input pins inp and inn , the internal temperature reference sensor signals, or an input short for measuring offset. a full measurement request will trigger a n automatic sequence of all measurement types and all input signals. the temperature reference sensor block is based on a resistive sens ing element . figure 2 . 1 zssc 3036 functional block diagram s e n s o r b r i d g e a g n d / c m g e n e r a t o r b i a s c u r r e n t g e n e r a t o r p o w e r - o n r e s e t t e m p e r a t u r e r e f e r e n c e s e n s o r 1 8 - b i t d s p c o r e ( c a l c u l a t i o n s , c o m m u n i c a t i o n ) m t p r o m s y s t e m c o n t r o l u n i t m u l t i p l e x e r p r e - a m p l i f i e r v t p v t n e o c i n p i n n v d d v s s b r i n g o s c i l l a t o r c l o c k g e n e r a t o r s e l s p i i 2 c t m s c l k / s c l m i s o m o s i / s d a s s v s s v o l t a g e r e g u l a t o r p o w e r c t r . v r e g i n t a d 1 6 b i t v d d b z s s c 3 0 3 6
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 12 of 49 the amplifier consists of two stages with programmable gain values. the 1/f noise and inherent offset are suppressed by auto - zero and chopper stabilizer techniques. th is auto - zero sequence is performed before each b ridge sensor and temperature measurement to compensate for the inherent offset of the amplifier. the zssc 3036 employs a 2 - stage analog - to - digital converter (adc) based on switched - capacitor technique with inherit low - pass behavior and noise suppression. t he programmable resolution from 10 to 16 bit s provides flexibility for adapting the conversion characteristics. to improve power supply noise suppression, the adc uses the bridge supply v ddb as its reference voltage. the remaining ic - internal offset and th e sensor element offset , i.e., the overall system offset for the amplifier and adc , can be canceled by an offset and auto - zero measurement , respectively . the dsp accomplishes the auto - zero , span, and 1 st and 2 nd order temperature compensation of the measur ed bridge signal. the correction coefficients are stored in the mtp memory. the zssc 3036 supports spi and i 2 c ? interface communication for controlling the zssc3036 , configuration , and measurement result output. 2.3. analog front end 2.3.1. amplifier the amplifier has a differential architecture and consists of two stages . the amplification of each stage and the sensor bridge gain polarity are programmable via settings in the meas urement configuration register bm_config (address 10 hex ; see section 3.6.3 ) in the mtp memory (see section 2.4.2 ). the first five bits of bm_config are the programmable gain setting s gain_stage1 and gain_stage2 . the options for the programmable gain settin gs are listed in table 2 . 1 and table 2 . 2 . table 2 . 1 amplifier gain: stage 1 gain_stage1 bm_config bit g1 bm_config bit g0 stage 1 gain setting 0 0 12 0 1 20 1 0 30 1 1 40
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 13 of 49 table 2 . 2 amplifier gain: stage 2 gain_stage2 bm_config bit g4 bm_config bit g3 bm_config bit g2 stage 2 gain setting 0 0 0 1.1 0 0 1 1.2 0 1 0 1.3 0 1 1 1.4 1 0 0 1.5 1 0 1 1.6 1 1 0 1.7 1 1 1 1.8 if needed, the polarity of the sensor bridge gain can be reversed by setting the gain_ p olarity bit , which is bit 5 in the bm_config register ( s ee section 3.6.3 ) . changing the gain polarity is achieved by inverting the chopper clock. table 2 . 3 gives the settings for the gain_ p olarity bit. this feature enables applying a sensor to the zssc 3036 with swapped input signals at inn and inp ; e.g., to avoid cro ssing wires for the final sensor modules assembly. table 2 . 3 gain polarity gain_ p olarity ( bm_config bit 5) gain setting d escription 0 +1 no polarity change . 1 - 1 gain polarity is inverted . the inher en t amp lifier offset is suppressed by means of auto - zero and chopper techniques. the optimal gain (and offset) setup for a specific sensor element can be determined by these steps : 1) collect sensor elements characteristic, statistical data (over temperature, ambi ent sensor parameter , and over production tolerances) : a. minimum differential output voltage: v min b. maximum differential output voltage: v max note : the best possible setup can only be determined if the absolute value of v max is bigger than the absolute value of v min . if this is not the cas e, the gain polarity should be reversed . 2) if v min and v max have different signs (normally: v max is positive and v min is negative), then the required adc offset shift can be selected using th is ratio: ratio offset = | v min | / (v max C v min ) . in this case , the respective offset setup (a2d_offset) is the nearest integer of multiples of 1/16 in the range of 1/16 to 8/16 ( see table 2 . 8 ) : a2d_offset = round_to_x16 th { ratio offset } .
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 14 of 49 3) determine wh ich of the two following cases is valid. a. if ratio offset C a2d_offset 0 then c alculate t heoretical optimum gain: gain opt = (1 C a2d_offset) * v ref / v max b. if ratio offset C a2d_offset > 0 then calculate t heoretical optimum gain: gain opt = a2d_o ffset * v ref / | v min | with: v ref = v refp C v refn = 0.94v ddb , min ? 1.5v finally, s elect the setup gain ( gain setup ) as the nearest gain to gain opt , where gain setup gain opt . 2.3.2. analog - to - digital converter a second - order charge - balancing analog - to - digital co nverter (adc) is used to convert the amplifier signal. to allow optimizing the trade - off between conversion time and resolution , the conversion is split into a msb coarse conversion and an lsb fine conversion. the final adc resolution is determined by msb + lsb. for the bridge measurement, t he msb - lsb segmentation is programmable via the msb and lsb settings in the bm_config register (10 hex ; s ee section 3.6.3 ) stored in the mtp memory (see section 2.4.2 ) . for the temperature measurement, the msb - lsb segmentation is programmable via the temp_adc settings in the bm_config register. the conversion time is proportional to 2 msb +2 lsb . during the msb coarse conversion, the a dc input signal is sampled and integrated 2 msb times , resulting in inherit low - pass behavior and noise suppression . t he longer the msb coarse conversion is , the better the noise suppression is . po ssible settings are listed below in table 2 . 4 and table 2 . 5 . table 2 . 4 msb/lsb segmentation settings for bridge measure ment msb setup bits [7:6] in bm_config number of msb coarse conve rsion bits lsb setup bits [9:8] in bm_config number of lsb fine conversion bits 00 bin 10 00 bin 0 01 bin 12 01 bin 2 10 bin 14 10 bin 4 11 bin 16 11 bin 6 table 2 . 5 msb/lsb segmentation settings for temperature measurement temp_adc setup bits [14:13] in bm_config number of msb coarse conversion bits number of lsb fine conversion bits 00 bin s etup according to zmdi configuration in reserved memory ( recommended setup for best performance and speed trade - off) 01 bin 16 0 10 bin 10 6 11 bin 12 4
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 15 of 49 useful msb/ lsb setups are with lsb = 0 (msb - only conversions) or combinations that result in msb + lsb 1 6 . resolutions beyond 16 - bit mainly digitize the collected front - end noise and typically do not improve the system performance. the adc conversion times for different msb/lsb settings are listed in ta ble 2 . 6 . ta ble 2 . 6 adc conversion times for a s ingle a2d c onversion msb [bit s ] lsb [bit s ] bridge or temperature measurement conversion time in ? s (typical) 10 0 590 12 0 2400 14 0 9500 16 0 37100 10 2 620 12 2 24 30 14 2 9530 10 4 650 12 4 2460 10 6 700 table 2 . 7 shows the trade - off between noise performance and typical conversion time for 1 6 - bit result s for a signal that has been fully conditioned using 4 single meas urements : the auto - zero bridge measurement (azbm) , the bridge measurement (bm), auto - zero temperature measurement (aztm), and temperature measurement ( tm ).
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 16 of 49 table 2 . 7 typical conversion times vs. noise performa nce for 16 - b it results with full sensor signal conditioning for azbm, bm, aztm, and tm note: the pink shading indicates zmdis recommended adc segmentation for temperature sensor measurement . adc segmentation: temperature sensor [msb/lsb] adc segmentatio n: bridge sensor [msb/lsb] ty pical measurement duration, measure , ( ac hex ) [ms] typ ical 3 - s igma noise for ssc - c orrected output 1) [counts] 10 / 6 10 / 6 3. 5 11.0 10 / 6 12 / 4 7. 9 7.2 10 / 6 14 / 2 25. 7 5.7 1 0 / 6 16 / 0 9 7 . 1 5.6 12 / 4 10 / 6 7. 9 10.3 12 / 4 12 / 4 11. 9 6. 9 12 / 4 14 / 2 29. 4 5. 5 12 / 4 16 / 0 102 . 4 5. 2 16 / 0 10 / 6 97.1 9.7 16 / 0 12 / 4 10 2 . 4 6.5 16 / 0 14 / 2 120.5 5. 3 16 / 0 16 / 0 19 4 .2 4.8 1) reference noise values obtained wit h this setup: 13.7k ? se nsor bridge, 25c, gain=64, adc shift= - 1/16 through 15/16 (see below) , vdd =1.8v. the adc offset is programmable in 8 steps so that the adc input voltage range can be adapted to the voltage range at the input pins inp and inn. possib le adc input voltages are shown in figure 2 . 2 , where v agnd ? v ddb /2. the adc offset is controlled by the a2d_offset setting bits [12:10] in the measurement configuration register bm_config (10 hex ; see section 3.6.3 ) in the mtp memory (see section 2.4.2 ) . the adc offset settings are listed in table 2 . 8 . see section 1.4 for t ypical values for v refn and v refp .
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 17 of 49 figure 2 . 2 adc offset table 2 . 8 adc offset settings z2 z1 z0 adc d ifferential i nput r ange/v ref where v ref = v refp - v refn a2d_offset 0 0 0 - 1/16 to 15/16 1/16 0 0 1 - 2/16 to 14/16 2/16 0 1 0 - 3/16 to 13/16 3/16 0 1 1 - 4/16 to 12/16 4/16 1 0 0 - 5/16 to 11/16 5/16 1 0 1 - 6/16 to 10/16 6/16 1 1 0 - 7/16 to 9/16 7/16 1 1 1 - 8/16 to 8/16 8/16 v r e f p v r e f n v i n , v i p a d c o u t 1 0 1 / 1 6 8 / 1 6 a 2 d _ o f f s e t v i n p , a 2 d _ o f f s e t = 1 / 1 6 v i n n , a 2 d _ o f f s e t = 1 / 1 6 v i n p , a 2 d _ o f f s e t = 8 / 1 6 v i n n , a 2 d _ o f f s e t = 8 / 1 6 v a g n d
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 18 of 49 2.3.3. temperature measurement the zssc 3036 provides an internal temperature sensor measurement to allow compensation for temperature effects . see section 1.3 for the temperature sensor resolution . the temperature sensor uses bipolar transistors. any transistor circuitry mismatch is suppressed by dynamic element matching technique. the temperature output signal is a differential voltage that is adapted by the amplifier for the adc input . for temperature measurements , the adc offset and amplifier gain setting are defined by zmdi. the adc msb/lsb segmentation is programmable by the user for optimizing noise immunity or conversion time (see section 2.3.2 ) . 2.3.4. bridge supply the zssc 3036 provides dedicated br idge supply pins vddb and vssb. the adc reference voltages for the sensor bridge measurement are derived from the se internal voltages so that bridge supply disturbances are suppressed. the current drive ability of v ddb is limited (see i vddb in section 1.2 ). 2.4. digital section 2.4.1. digital signal processor (dsp) core the dsp core block performs the algorithm for correcting the sensor signal. the resulting coefficients are stored in the mtp memory. when the measurement res ults are available , the "end of conversion" signal is set at the eoc pin . the internal eoc information is valid only if both the measurement and calculation have been completed. 2.4.2. mtp memory the zssc 3036 s memory is designed with an otp (one - time programmabl e) structure. the memory is organized in 4 one - time programmable pages. when data in the currently valid memory page needs to be updated, normally a new page must be selected by increasing the page counter and the whole memory content must be written in it s updated version. the user has access to a 24 x 16 bit storage area for values such as calibration coefficients . dedicated calibration values are stored in an area not accessible to the user . the required programming voltage is generated internally in the zssc3036 whereas increased zssc3036 power supply requirements must be fulfilled during programming (see memory programming voltage in section 1.3 ) . there is no over - write or erase function for the mtp memory. t he physical memory function is such that each single bit that has not yet been set to 1 ( i.e., remains 0) can still be changed to 1, so it is possible to (partially) re - program an mtp register as shown in the following example: ? assume mtp address 11 hex was written with 8421 hex which is 1000 0100 0010 0001 bin . ? changing the register content s to a6a7 hex (i.e., 1010 0110 1010 0111 binary ) can be achieved by either writing a6a7 hex (any already written bit will be ignored automatically) or just writing the differe nce compared to 8421 hex , which is 2286 hex .
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 19 of 49 the content of a re - written register can generally be determined by content register = content old ( bitwise_ or ) content new . if content register equals content new , a re - write is possible ; e.g., this is not the case f or content old = ffff hex and content new ffff hex . d epending on the former and the newly intended mtp address es and register content s a re - programming could be possible. 2.4.3. clock generator the clock generator , implemented as a ring oscillator, provides a 4mhz clock signal. the frequency is trimmed during production test. 2.4.4. power supervision the p ower s upervision block as a part of the voltage regulator combined with the digital section monitors all power supplies to ensure a defined reset of all digital blocks d uring power - up or power supply interruptions. 2.4.5. interface the zssc 3036 can communicate with the users pc via an spi or i 2 c ? interface * . the interface type is select - able via the voltage level on the sel pin : ? sel = 0 - > spi m ode ? sel = 1 - > i 2 c ? m ode if the sel pin is not connected, i2c ? communication will be selected (ic - internal pull - up at sel pin). t he spi - specific pins (ss, miso) do not need to be connected for i2c ? operation. to also provide interface ac c essibility in sleep s tate (all features inactive except for the digital interface logic) , the interface circuitry is directly supplied by vdd. * f unctional i 2 c? inte rface properties correspond to the nxp i2c? bus specification rev. 0.3 (june 2009) .
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 20 of 49 3 functional description 3.1. power up specifi cations for this section are given in sections 1.2 and 1.3 . on power - up, the zssc 3036 communication interface is able to receive the first command after a time t sta1 from when the vdd supply is within operating specifications . the zssc 3036 can begin the first measurement after a time of t sta2 . from when the vdd supply is operational. the wake up time from sleep state to active state (see section 3.3 ) after receiving the a ctivating command i s defined as t wup1 and t wup2 . in c ommand m ode , subsequent commands can be sent after t wup1 . the first measurement start s after t wup2 if a measurement request was sent . 3.2. measurements availab le measurement procedures are ? azbm: auto - zero bridge measurement ? bm: bridge measurement ? aztm: auto - zero temperature measurement ? tm: temperature measurement azbm: the configuration for bridge measurement s is loaded. the mul t iplexer block connects the a mpli fier input to the agnd analog ground reference . an analog - to - digital conversion is performed so that the inherent system offset for the bridge configuration is converted by the adc to a 16 - bit digital word. bm: the configuration for bridge measurement s is loaded. the mul t iplexer connects the a mplifier input to the bridge pins inp and inn. an analog - to - digital conversion is performed . the result is a 16 - bit digital word. aztm: the configuration for temperature measurement s is loaded. the mul t iplexer connect s the a mplifier input to agnd. an analog - to - digital conversion is performed so that the inherent system offset for the temperature configuration is converted by the adc to a 16 - bit digital word. tm: the configuration for temperature measurement s is loaded. the mul t iplexer connects the amplifier input to the internal temperature sensor. an analog - to - digital conversion is performed . the result is a 16 - bit digital word. the typical applications measurement cycle is a complete ssc m easurement (using the comman d ac hex ) with azbm, bm, aztm, and tm followed by a signal correction calculation .
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 21 of 49 3.3. operational modes figure 3 . 1 illustrates the zssc 3036 power - up sequence and subseq uent operation depending on the selected interface communication mode (i 2 c? or spi) as determined by the sel pin voltage level (see section 2.4.5 ) . with either interface, after the voltage regulators are switched on, the zssc 3036 s low voltage section (lv) is a ctive while the related interface configuration information is read from memory . then the lv section is switched off , the zssc 3036 goes in to sleep state , and t he interface is ready to receive commands. since the interface is always powered by v dd , it is re ferred to as the high voltage section (hv). s ee table 3 . 1 for definitions of the command s . figure 3 . 2 shows the zssc 3036 operation in normal mode and command mode includin g when the lv and hv sections are active as indicated by the color legend . the normal mode automatically returns to sleep state after executing the requested measurements. in command mode , the zssc 3036 remains active if a dedicated command (start_nom) wa s sent, which is helpful during calibration. command mode can only be entered if start_cm is the first command received after por .
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 22 of 49 figure 3 . 1 operational flow chart: pow er u p r e c e i v e : c o m m a n d h v - o p e r a t i o n l v - o p e r a t i o n s e l = = 1 n o ( s p i ) y e s ( i 2 c t m ) i 2 c t m - i n t e r f a c e s p i - i n t e r f a c e c o m m a n d : l o a d i c - i 2 c a d d r . l v o p e r a t i o n i c p o w e r o n p o w e r d o w n ( s w i t c h o f f l v a n d w a i t f o r c o m m a n d ) s a v e : i c i 2 c a d d r e s s / d a t a / s t a t u s c o l o r l e g e n d : r e c e i v e d i 2 c s l a v e _ a d d r = = i c i 2 c s l a v e _ a d d r y e s i o _ m o d e = i 2 c t m i o _ m o d e = s p i s w i t c h o f f p u l l - u p a t s e l e x e c u t e : d a t a f e t c h r e a d _ b i t = = 1 ( d a t a f e t c h ) y e s n o d a t a / s t a t u s f r o m l v c o m m a n d m o d e = = a c t i v e y e s n o p o w e r u p l v c o m m a n d : l o a d i / o s e t u p l v o p e r a t i o n s a v e : s e t u p / d a t a / s t a t u s d a t a / s t a t u s f r o m l v p o w e r u p l v p o w e r d o w n ( s w i t c h o f f l v a n d w a i t f o r c o m m a n d ) s s = = 1 y e s e x e c u t e : d a t a f e t c h r e c e i v e d c m d = = r e a d _ d f y e s c o m m a n d m o d e = = a c t i v e y e s n o n o r e c e i v e : c o m m a n d n o n o
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 23 of 49 figure 3 . 2 operational flow chart: command mode and normal mod e 3.4. command interpretation 3.4.1. spi/i 2 c ? c ommands the user - accessible section of memory includes addresses 00 hex through 17 hex in the otp memory that is designated by the user memory page pointer. because each of the four otp memor y pages cannot be re written or erased, the memory page pointer must be incremented to the next otp memory page in order to write to memory again ( see table 3 . 1 for the command). after all four user - accessible otp memor y page s have been used, further write operations are not possible and the memory full bit is returned as set in the status byte after write operations (see section 3.5.1 ). s l e e p m o d e r e c e i v e : c o m m a n d s t a r t _ n o m e x e c u t e : c o m m a n d h v - o p e r a t i o n l v - o p e r a t i o n c o l o r l e g e n d : c m d = = s t a r t _ c m y e s n o g e t c o m m a n d f r o m h v c o m m a n d m o d e c a s e ( c o m m a n d ) r e g u l a r _ c m d i n v a l i d _ c m d d a t a / s t a t u s f r o m l v c m a c t i v e s t a r t l v e n d l v c m i n a c t i v e e x e c u t e : c o m m a n d c a s e ( c o m m a n d ) r e g u l a r _ c m d i n v a l i d _ c m d d a t a / s t a t u s f r o m l v
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 24 of 49 the spi/i 2 c ? commands supported by the zssc 3036 are listed in table 3 . 1 . the command to read an address in the user memory is the same as its address. the command to read the 16 - bit memory status of the data at an address in user memory is the address plus 20 hex . the command to write to an address in user memory is the address plus 40 hex . the re is a zmdi - reserved section of memory that can be read but not over - written by the user. table 3 . 1 spi/i 2 c ? commands note: every return starts with a status byte followed by the data word as described in section 3.5.1 . command (byte) return description normal mode command mode 00 hex to 17 hex 16 - bit user data read data in the user memory address (00 hex to 17 hex ) matching the command ( m ight not be using all addresses ) . yes yes 20 hex to 37 hex 16 - bit user memory s tatus read memory status for address specified by command minus 20 hex ( address es 00 hex to 17 hex respectively ; see section 3.6.2 for a description of the memory status ) . yes yes 40 hex to 57 hex followed by data (0000 hex to ffff hex ) hex ( address es 00 hex to 17 hex respectively; might not be using all addresses) . no yes 70 hex to 7e hex 16 - bit zmdi - reserved memory data read data in zmdi - reserved memor y at address specified by command minus 70 hex ( second set of address es 00 hex to 0e hex respectively ) . no yes 80 hex to 8e hex 16 - bit zmdi - reserved memory status read memory status bytes for zmdi - reserved memory data at address specified by command minus 80 h ex ( second set of address es 00 hex to 0e hex respectively; see section 3.6.2 for a description of the memory status bytes) . no yes 5e hex hex to a 7 hex followed by x xxx hex (see table 3 . 2 ) 16 - bit wide raw data get_raw this command can be used to perform a measurement and write the raw adc data into the output register. the lsb of the command determines how the afe c onfig uration register is loaded for the get_raw measurement (see table 3 . 2 ) . yes yes a8 hex start_nom exit command mode and transition to normal mode. no yes a9 hex start_cm exit normal mode and transition to command mod e. yes no
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 25 of 49 command (byte) return description normal mode command mode aa hex write_checksumc if not yet written, the checksum for the valid user mtp page is cal - culated and written to mtp . no yes ac hex 16 - bit fully corrected bridge measurement data + 16 - bit corrected internal temperature measure t rigger s full m easurement cycle (azbm, bm, aztm, and tm , as described in section 3.2 ) and calculation and storage of data in interface ( configurations from mtp ) . yes yes f x hex status followed by last d ata nop o nly valid for spi (see 3.5.1 and 3.5.2 ). yes yes table 3 . 2 get_raw commands command measurement afe configuration register a0 hex f o llowed by 0000 hex bm C bridge measurement b m _config a1 hex followed by ssss hex bm C bridge measurement ssss is the users configuration setting for the measure - ment provided via the interface. the format and pur - pose of configuration bits must be accord ing to the definitions for bm_config . a2 hex followed by 0000 hex bm - azbm C auto - zero c orrected bridge measurement 1) b m _config a3 hex followed by ssss hex bm - azbm C auto - zero c orrected bridge measurement 2) ssss is the users configuration setting for the measure - ment provided via the interface. the format and pur - pose of configuration bits must be according to the definitions for bm_config . a4 hex followed by 0000 he x tm C temperature measurement zmdi - defined register a5 hex followed by ssss hex tm C temperature measurement ssss is the users configuration setting for the measure - ment provided via the interface. the format and pur - pose of configuration bits must be according to the definitions for bm_config being valid for temp erature measurement in this case (bits [15:13] will be ignored). a6 hex followed by 0000 hex tm - aztm C auto - zero c orrected temperature measurement 1) zmdi - defined register a7 hex followed by ssss hex tm - aztm C auto - zero c orrected temperature measurement 2) ssss is the users configuration setting for the measure - ment provided via the interface. the format a nd pur - pose of configuration bits must be according to the definitions for bm_config being valid for temp erature measurement in this case (bits [15:13] will be ignored). 1) recommended for raw data collection during calibration coefficient determination usin g pre - programmed (in mtp) measurement setups . 2) recommended for raw data collection during calibration coefficient determination using un - programmed (not in mtp), external measurement setups ; e.g. , for evaluation purposes .
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 26 of 49 3.5. communication interface 3.5.1. common f un ctionality commands are handled by the command interpreter in the lv section . commands that need additional data are not treated differently than other commands because the hv interface is able to buffer the command and all the data that belongs to the com mand and the command interpreter is activated as soon as a command byte is received . every response starts with a status byte followed by the data word. the data word d epends on the previous command. it is possible to read the same data more than once if t he read request is repeated (i 2 c ? ) or a nop command is se nt (spi). if the next command is not a read request (i2c ? ) or a nop (spi), it invalidates any previous data. the status byte contains the following bits (see table 3 . 3 , table 3 . 4 , and table 3 . 5 for sequence): ? power indication ( b it 6) : 1 if the device is powered (v dd b on ); 0 if not powered. this is needed for spi m ode where the master reads all zero s if the device is not powered or in power - on reset (por) . ? busy indication ( b it 5) : 1 if the device is busy, which indicates that the data for the last command is not available yet. no new commands are processed if the device is busy . ? actual zssc 3036 mode ( b its 4:3) : 00 = normal mode; 01 = command mode ; 1 x = zmdi - r eserved . ? memory integrity/error flag ( b it 2) : 0 if integrity test passed, 1 if test failed . this bit indicates whether the checksum - based integrity check passed or failed. co rrectable errors are not reported but can be queried with the memory status commands (see section 3.6.2 ) . the memory error status bit is calculated only during the power - up sequence , so a newly written crc will only be used for memory verification and status update after a subsequent zssc3036 power - on reset (por) . ? data transfer /correction ( b it 1) : if the last command was a memory write, this bit is 0 if the last memory write was successful (memory not full yet) ; otherwise it is 1 (e.g. , page increase but already on last mtp page) . if the last command was a memory read, this bit is 1 if the data was corrected. table 3 . 3 general status byte bit 7 6 5 4 3 2 1 0 meaning 0 powered ? busy ? mode memory e rror ? internal d ata t ransfer special table 3 . 4 status byte for read operations bit 7 6 5 4 3 2 1 0 meaning 0 powered ? busy ? mode memory error ? data corrected ? alu saturation ? table 3 . 5 status byte for write operations bit 7 6 5 4 3 2 1 0 meaning 0 powered ? busy ? mode memory error ? memory full ? ? mtp write reject ? dont care
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 27 of 49 table 3 . 6 mode status status[4:3] mode 00 normal m ode 01 command mode 10 zmdi - reserved 11 command m ode and reserved furt her status information is provided by the eoc pin. the eoc pin is set high when a measurement and calculation have been c ompleted. 3.5.2. spi the spi m ode is available w hen the sel pin = 0. the polarity and phase of the spi clock are programmable via the ckp_cke setting in address 02 hex as described in table 3 . 8 . ckp_cke is two bits: cpha ( bit 10) , which selects which edge of sclk latches data, and cpol (bit 11) , which indicates whether sclk is high or low when it is idle. the polarity of the ss signal and pin are programmable via the ss_polarity setting (bit 9). the different combinations o f polarity and phase are illustrated in the figures below . figure 3 . 3 spi c onfiguration cpha=0 msb sclk ( cpol = 0 ) bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 lsb msb bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 lsb sclk ( cpol = 1 ) mosi miso / ss sample cpha = 0
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 28 of 49 figure 3 . 4 spi configuration cpha=1 in spi mode , each comm and except nop is started as shown in figure 3 . 5 . after the execution of a command (busy = 0) , the expected data can be read as illustrated in figure 3 . 6 or if no data are returned by the command , the next command can be sent . the status can be read at any time with the nop command (see figure 3 . 7 ). figure 3 . 5 spi command request msb sclk ( cpol = 0 ) bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 lsb msb bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 lsb sclk ( cpol = 1 ) mosi miso / ss sample cpha = 1 cmddat < 15 : 8 > cmddat < 7 : 0 > command other than nop status data data command request mosi miso note : a command request always consists of 3 b ytes . if the command is shorter , then it must be completed with 0 s . the data on miso depend on the preceding command .
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 29 of 49 figure 3 . 6 spi read status figure 3 . 7 spi read data command = nop status read status mosi miso status memdat < 15 : 8 > memdat < 7 : 0 > bridgedat < 15 : 8 > bridgedat < 7 : 0 > tempdat < 15 : 8 > tempdat < 7 : 0 > command = nop 00 hex 00 hex status command = nop 00 hex 00 hex 00 hex 00 hex read data mosi ( a ) example : after the completion of a memory read c ommand miso ( b ) example : after the completion of a f ull me asurement command ( ac hex ) mosi miso
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 30 of 49 3.5.3. i 2 c ? i 2 c m ode is selected by the sel pin = 1. in i 2 c m ode , each command is started as shown in f igure 3.8 . only the number of bytes that is needed for the command must be sen t . an exception is the hs - mode where 3 b ytes must always be sent as in spi m ode. after the execution of a command (busy = 0) , the expected data can be read as illustrated in figure 3 . 10 or if no data are returned by the command , the next command can be sen t . the status can be read at any time as described in figure 3 . 9 . figure 3 . 8 i 2 c ? command request figure 3 . 9 i 2 c ? read status s s l a v e a d d r a 0 c o m m a n d a p s s l a v e a d d r 0 a c o m m a n d a c m d d a t < 1 5 : 8 > a c m d d a t < 7 : 0 > a p c o m m a n d r e q u e s t ( i 2 c ? w r i t e ) w r i t e w r i t e f r o m m a s t e r t o s l a v e f r o m s l a v e t o m a s t e r s s t a r t c o n d i t i o n p s t o p c o n d i t i o n a n a c k n o w l e d g e n o t a c k n o w l e d g e s s l a v e a d d r 1 a s t a t u s n p r e a d s t a t u s ( i 2 c ? r e a d ) r e a d
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 31 of 49 figure 3 . 10 i 2 c ? read data all mandatory i2c - bus protocol features are impl emented. optional features like c lock s tretching, 10 - bit slave address, etc. , are not supported by the zssc 3036 s interface. in i2c - high - speed mode, a command consists of a fixed length of three bytes. 3.6. memory in the zssc 3036 , the memory is organized page - wise and can be programmed multiple (4) time s (mtp). each register can only be programmed once per page. the valid page is determined by the page counter which can be incremented with the command 5e hex C this leads to a reset of all registers and a re - pr ogramming is necessary . increasing the customer page counter will disable all old register contents of the former page. it is possible to (re - ) program a total of 4 pages . resetting the page counter is not possible. the page counter starts with 0 and can b e incremented to a maximum of 3 . if the 4 th memory page has been used, no further changes in the memory are possible C careful writing and page incrementing is strongly recommended. there are two mtp page types: ? customer page: accessible by means of regul ar write operations ( 40 hex to 57 hex ). it cont ains: the customer id , interface setup data, measurement setup information, calibration coefficients, etc. ? zmdi page: only accessible for write operations by zmdi. the zmdi page contains specific trim informati on and is programmed during manufacturing test by zmdi. 3.6.1. programming memory programming memory requires a specific supply voltage level (>2.9v) at the v dd pin (see section 1.3 for specifications) . the mtp program ming voltage itself is generated by means of an implemented charge pump , generating an internal memory programming voltage (vpp) ; no additional, external voltage , other than vdd needed . the program timing is shown in figure 3 . 11 . supplying the zssc 3036 with vdd > 2.9 v during memory programming is re quired . after the memory is programmed , it must be read again to verify the validity of the memory content s . s s l a v e a d d r 1 a s t a t u s a m e m d a t < 1 5 : 8 > a m e m d a t < 7 : 0 > n p s s l a v e a d d r 1 a s t a t u s a b r i d g e d a t < 1 5 : 8 > a b r i d g e d a t < 7 : 0 > n p a t e m p d a t < 1 5 : 8 > a t e m p d a t < 7 : 0 > r e a d d a t a ( i 2 c ? r e a d ) ( a ) e x a m p l e : a f t e r t h e c o m p l e t i o n o f a m e m o r y r e a d c o m m a n d r e a d ( b ) e x a m p l e : a f t e r t h e c o m p l e t i o n o f a f u l l m e a s u r e m e n t c o m m a n d ( a c h e x ) r e a d
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 32 of 49 figure 3 . 11 mem ory program operation 3.6.2. memory status command s the 16 - bit memory status answer for the commands: 20 hex to 37 hex and 80 hex to 8e hex contains the following information : ? one bit indicating if the data read was corrected. ? two bits indicating the current page in use. table 3 . 7 memory status word bit description 15 (msb) data was corrected (0: no, 1: yes) 14 current p age 13 1 2 :0 undefined C do not use s t a r t _ c m c o m m a n d m e m w r m e m w r m e m o r y w r i t e c u s t o m e r a d d r e s s m e m w r m e m w r v p p m e m r d m e m r d m e m o r y r e a d c u s t o m e r a d d r e s s t v p p t v p p
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 33 of 49 3.6.3. memory content s table 3 . 8 mtp memory content assignments mtp address word / bit range default setting description notes / explanations 00 hex 15:0 0000 hex cust_id0 customer id byte 0 (combines with m emory word 01 hex to form customer id) 01 hex 15:0 0000 hex cust_id1 customer id byte 1 (combines with m emory word 0 0 hex to form customer id) interface configuration 02 hex 6:0 00 0 0000 bin slave_addr i2c ? slave address; valid range: 00 hex to 7f hex (default: 00 hex ), remark: address codes 04 hex to 07 hex are reserved for ent ering the i 2 c ? h igh s peed m ode 8:7 00 bin - reserved 9 0 bin ss_polarity determines the polarity of the s lave s elect pin (ss) for spi operation: ? 0 ? slave s elect is active low (spi and zssc 3036 are active i f ss==0) ? 1 ? slave s elect is active high (spi an d zssc 3036 are active if ss==1) 11:10 00 bin ckp_cke clock polarity and clock - edge select determines polarity and phase of spi interface clock with the following modes: ? 00 ? sclk is low in idle state, data latch with rising edge and data output with falli ng edge ? 01 ? sclk is low in idle state, data latch with falling edge and data output with rising edge ? 10 ? sclk is high in idle state, data latch with falling edge and data output with rising edge ? 11 ? sclk is high in idle state, data latch with rising edg e and data output with falling edge 15:12 - not assigned
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 34 of 49 mtp address word / bit range default setting description notes / explanations signal conditioning parameter s 03 hex 0 0 bin offset_b[16] bridge offset, bit[16] functions as the msb and combine s with offset_b[15:0] in 05 hex to form the 17 - bit coefficients absolute value 1 0 bin offset_b_sign sign for sensor bridge offset (off set_b): 0 => a positive value or 1 => a negative value 2 0 bin gain_b[16] bridge gain, bit[16] functions as the msb and combines with gain_b[15:0] in 06 hex to form the 17 - bit coefficients absolute value 3 0 bin gain_b_sign sign of the sensor bridge gain (gain_b): 0 => a positive value or 1 => a negative value 4 0 bin tcg[16] 1 st - order temperature coefficient of the bridge gain, bit[1 6 ] functions as the msb and combines with tcg[15:0] in 07 hex t o form the 17 - bit coefficients absolute value 5 0 bin tcg_sign sign of 1 st - order temperature coeffi cient (tcg) : 0 => a positive value or 1 => a negative value 6 0 bin tco[16] 1 st - order temperature coefficient of the bridge offset, bit [ 16] functions a s the msb and combines with tco[15:0] in 08 hex to form the 17 - bit coefficients absolute value 7 0 bin tco_sign sign of 1 st - order temperature coefficient (tco): 0 => a positive value or 1 => a negative value 8 0 bin sot_tco[16] 2 nd - order temperature co efficient of the bridge offset, bit [ 16] functions as the msb and combines with sot_ t co[15:0] in 09 hex to form the 17 - bit coefficients absolute value 9 0 bin sot_tco_sign separate sign setting for 2 nd - order tempe rature coefficient (sot_tco) : 0 => a posi tive value or 1 => a negative value 10 0 bin sot_tcg[16] 2 nd - order temperature coef ficient of the bridge gain, bit [16] functions as the msb and combines with sot_ t cg[15:0] in 0a hex to form the 17 - bit coefficients absolute value
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 35 of 49 mtp address word / bit range default setting description notes / explanations 11 0 bin sot_tcg_sign s eparate sign setting for 2 nd - order temperature coefficient (sot_tcg): 0 => a positive value or 1 => a negative value 12 0 bin sot_bridge[16] 2 nd - order coefficient of the bridge signal , bit[16] functions as the msb and combines with sot_bridge[15:0] in 0b hex to form the 17 - bit coefficients absolute value 13 0 bin sot_bridge_sign separate sign setting for 2 nd - order bridge coefficient (sot_bridge) : 0 => a positive value or 1 => a negative value 14 0 bin sot_curve typ e of second - order curve correction for the bridge sensor signal. 0 ? parabolic curve 1 ? s - shaped curve 15 0 bin tsetl_sign separate sign setting for t _ setl : 0 => a positive value or 1 => a negative value 04 hex 0 0 bin gain_t[16] temperature gain of temp erature senso r , bit[16] functi ons as the msb and combines with gain_t[15:0] in 0d hex to form the 17 - bit coefficients absolute value 1 0 bin gain_t_sign separate sign setting for the temperature gain (gain_t) : 0 => a positive value or 1 => a negative value 2 0 bin sot_t[16] 2 nd - ord er te mperature coefficient of temperature sen sor , bit [16] function s as the msb and combines with sot_t[15:0] in 0e hex to form the 17 - bit coefficients absolute value 3 0 bin sot_t_sign separate sign setting for 2 nd - order te mperature coefficient (sot_t): 0 => a positive value or 1 => a negative value 4 0 bin offset_t[16] temperature offset of temp erature sensor, bit[ 16] functions as the msb and combines with offset_t[15:0] in 0c hex to form the 17 - bit coefficients absolute value 5 0 bin offset_t_sig n separate sign setting for the temperature offset (offset_t): 0 => a positive value or 1 => a negative value
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 36 of 49 mtp address word / bit range default setting description notes / explanations 15:6 0 000 0 000 0 bin - not assigned 05 hex 15:0 0000 hex (7000 hex ) offset_b[15:0] bits [15:0] of the bridge offset correction coefficient, which is an 18 - bit wide absolute value ( the respective msbs offset_b[16] and sign, offset_b_sign , are under bit s [1:0] in 03 hex ) [ - 1/16 to 15/16] = 7000 hex (default for volume) [ - 2/16 to 14/16] = 6000 hex [ - 3/16 to 13/16] = 5000 hex [ - 4/16 to 12/16] = 4000 hex [ - 5 /16 to 11/16] = 3000 hex [ - 6/16 to 10/16] = 2000 hex [ - 7/16 to 9/16] = 1000 hex [ - 8/16 to 8/16] = 0000 hex (default for proto types ) 06 hex 15:0 0000 hex ( 8000 hex ) gain_b[15:0] bits[15:0] of 1 7 - bit wide absolute value of the bridge gain coefficient (default for prototypes : 0000 h ex ; default for volume production : 8000 h ex the respective msbs, gain_b[16] and sign, gain_b_sign , are under bit s [3:2] in 03 hex ) 07 hex 15:0 0000 hex tcg[15:0] coefficient for temperature correction of the bridge gain term C the respect ive msbs, tcg[16] and sign, tcg_sign , are under (bit s [5:4] in 03 hex ) 08 hex 15:0 0000 hex tco[15:0] coefficient for temperature correction of the bridge offset term C the respective msbs, tco[16] and sign, tco_sign , are under (bit s [7:6] in 03 hex ) 09 hex 15: 0 0000 hex sot_tco[15:0] 2 nd order term applied to tco C the respective msbs, sot_tco[16] and sign, sot_tco_sign , are under (bit s [9:8] in 03 hex ) 0a hex 15:0 0000 hex sot_tcg[15:0] 2 nd order term applied to tcg. C the respective msbs, sot_tcg[16] and sign, so t_tcg_sign , are under (bit s [11:10] in 03 hex ) 0b hex 15:0 0000 hex sot_bridge[15:0] 2 nd order term applied to the sensor bridge readout C the respective msbs, sot_bri d ge[16] and sign, sot_bridge_sign are under (bit s [13:12] in 03 hex )
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 37 of 49 mtp address word / bit range default setting description notes / explanations 0c hex 15:0 0000 hex (7000 hex ) offset_t[15:0] bits [15:0] of the t emperature offset correction coefficient ( the respective msbs, offset_t[16] and sign, offset_t_sign , are under (bit s [5:4] in 04 hex ) [ - 1/16 to 15/16] = 7000 h ex (default for volume) [ - 2/16 to 14/16] = 6 000 h ex [ - 3/16 to 13/16] = 5000 h ex [ - 4/16 to 12/16] = 4000 h ex [ - 5/16 to 11/16] = 3000 h ex [ - 6/16 to 10/16] = 2000 h ex [ - 7/16 to 9/16] = 1000 h ex [ - 8/16 to 8/16] = 0000 h ex (default for prototypes) 0d hex 15:0 0000 hex (8000 hex ) gain_t[15:0] bits [15:0] of the a bsolute value of the temperature gain coefficient (default for prototypes: 0000 hex ; default for volume production: 8000 h ex ) ; the respective msbs, gain_t[16] and sign, gain_t_sign , are under bit s [1:0] in 04 hex ) 0e hex 15:0 0000 hex sot_t[15:0] 2 nd order term applie d to the temperature reading C the respective msbs, sot_t[16] and sign, sot_t_sign , are under (bit s [3:2] in 04 hex ) 0f hex 15:0 0000 hex t_setl stores raw temperature reading at the temperature at which low calibration points were taken measurement configur ation register ( bm_config ) 10 hex 1:0 00 bin gain_stage1 gain setting for the 1 st premp stage with gain_stage1: ? 00 ? 12 ? 01 ? 2 0 ? 10 ? 3 0 ? 11 ? 4 0 4:2 000 bin gain_stage2 gain setting for the 2 nd preamp stage with gain_stage2: ? 000 ? 1.1 ? 001 ? 1.2 ? 010 ? 1.3 ? 011 ? 1.4 ? 100 ? 1.5 ? 101 ? 1.6 ? 110 ? 1.7 ? 111 ? 1.8
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 38 of 49 mtp address word / bit range default setting description notes / explanations 5 0 bin gain_polarity set up the polarity of the sensor bridges gain (inverting of the chopper) with ? 0 ? positive (no polarity change) ? 1 ? negative (180 polarity change) 7:6 00 bin (11 bin ) msb absolute number of bits for the msb conversion in the adc with msb : ? 00 ? 10 - bit ? 01 ? 12 - bit ? 10 ? 14 - bit ? 11 ? 16 - bit 9:8 00 bin lsb a bsolute number of bits for the l sb conversion in the adc with lsb : ? 00 ? 0 - bit (single stage adc) ? 01 ? 2 - bit ? 10 ? 4 - bit ? 11 ? 6 - bit 12:10 000 bin a2d_offset adc offset and resulting a2d i nput r ange [vref] with a2d_offset: ? 000 ? 1/16 results in range [ - 1/16, 15/16] ? 001 ? 2/16 results in range [ - 2/16, 14/16 ? 010 ? 3/16 results in range [ - 3/16, 13/16] ? 011 ? 4/16 results in range [ - 4/16, 12 /16] ? 100 ? 5/16 results in range [ - 5/16, 11/16] ? 101 ? 6/16 results in range [ - 6/16, 10/16] ? 110 ? 7/16 results in range [ - 7/16, 9/16] ? 111 ? 8/16 results in range [ - 8/16, 8/16] 14:13 00 bin temp_adc selection between fixed adc segmentations for temperature measurements: ? 00 ? setup according to zmdi - reserved memory (recommended setup for best performance and speed trade - off) ? 01 ? msb=16, lsb=0 (16 - bit) ? 10 ? msb=10, lsb=6 (16 - bit) ? 11 ? msb=12, lsb=4 (16 - bit) 15 0 bin - reserved 11 hex not assigned 12 hex not assigned 13 hex not assigned
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 39 of 49 mtp address word / bit range default setting description notes / explanations 14 hex not assigned 15 hex not assigned 16 hex not assigned 17 hex 15:0 - checksumc generated (checksum) for user page through a linear feedback shift register (lfsr); signature is checked with power - up to ens ure memory content integrity the memory integrity checksum ( referred to as crc ) is generated through a linear feedback shift register with the polynomial: g(x) = x 16 + x 15 + x 2 + 1 with the initial ization value : ffff hex . 3.7. calibration sequence calibration essentially involves collecting raw signal and temperature data from the s ensor - ic system for different known bridge values and temperatures. this raw data can then be processed by the calibration master (assumed to be a pc), and the calculated calibratio n coefficients can then be written to mtp memory. below is a brief overview of the steps involved in calibrating the zssc 3036 . there are three main steps to calibration: 1. assigning a unique identification to the zssc 3036 . this identification is written to s hadow ram and later programmed in mtp memory. this unique identification can be stored in the two 16 - bit registers dedicated to customer id. it can be used as an index into a database stored on the calibration pc. this database will contain all the raw val ues of bridge readings and temperature readings for that part, as well as the known bridge measurand conditions and temperature to which the bridge was exposed. 2. data collection. data collection involves getting uncorrected or raw data from the bridge at d ifferent known measurand values and temperatures. then this data is stored on the calibration pc using the unique identification of the device as the index to the database. 3. coefficient calculation and storage in mtp memory. after enough data points have be en collected to calculate all the desired coefficients, the coefficients can be calculated by the calibrating pc and written to the s hadow r am. after that, mtp memory is programmed with the contents of the shadow ram . 4. result . t he sensor signal and the char acteristic temperature effect on output will be linearized according to the setup - dependent maximum output range. it is essential to perform the calibration with a fixed programming setup during the data collection phase. in order to prevent any accidenta l misprocessing, it is further recommended to keep the mtp memory setup stable during the whole calibration process as well as in the subsequent operation. a zssc 3036 calibration only fits the single setup used during its calibration . changes of functional parameters after a successful calibration can decrease the precision and accuracy performance of the zssc 3036 as well as of the whole application.
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 40 of 49 3.7.1. calibration step 1 C assigning unique identification assign a unique identification number to the zssc 3036 by using the memory write command (40 hex + data and 41 hex + data; see table 3 . 1 and table 3 . 8 ) to write the identification number to cust_id0 at memory address 00 hex and cu st_id1 at address 01 hex as described in section 3.6.1 . these two 16 - bit registers allow for more than 4 trillion unique devices. 3.7.2. calibration step 2 C data collection the number of unique points ( measurand and/or temperature) at which calibration must be performed generally depends on the requirements of the application and the behavior of the resistive bridge in use. the minimum number of points required is equal to the number of bridge coefficients to be correct ed with a minimum of three different temperatures at three different bridge values . for a full calibration resulting in values for all 7 possible bridge coefficients and 3 possible temperature coefficients, a minimum of 7 pairs of bridge with temperature m easurements must be collected. within this minimum 3x3 measure ments field , data must be collected for the specific value pairs (at known conditions) and then processed to calculate the coefficients . in order to obtain the potentially best and most robust c oefficients, it is recommended that measurement pairs (temperature vs. measurand ) be collected at the outer corners of the intended operation range or at least at points that are located far from each other. it is also essential to provide highly precise r eference values as nominal, expected values. the measurement precision of the external calibration - measurement equipment should be ten times more accurate than the expected zssc 3036 output precision after calibration in order to avoid precision losses caus ed by the nominal reference values (e.g. , measurand signal and temperature deviations). note : an appropriate selection of measurement pairs can significantly improve the overall system performance. the determination of the measurand - related coefficients wi ll use all of the measurement pairs. for the temperature - related correction coefficients, 3 (at three different temperatures) of the measurement pairs will be used. note: there is an inherent redundancy in the 7 bridge - related and 3 temperature - related co efficients. since the temperature is a necessary output (which also needs correction), the temperature - related information is mathematically separated, which supports faster and more efficient dsp calculations during the normal usage of the sensor - ic syste m. the recommended approach for data collection is to make use of the raw - measurement commands: ? for bridge sensor values : o a 2 hex + 0000 hex : single bridge measurement for which the configuration register will be loaded from the b m _config register (10 hex in mtp); p reprogramming the measurement setup in the mtp is required. o a3 hex + ssss hex : single bridge measurement for which the bm_config c onfiguration register (gain, adc, offset, etc.) will be loaded as ssss hex and must be provided externally via the in terface.
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 41 of 49 ? for temperature values : o a6 hex + 0000 hex : single temperature measurement for which the configuration register will be loaded from an internal temperature configuration register (preprogrammed by zmdi in mtp ); preprogramming of the respective confi guration is done by zmdi prior to ic delivery . this is the recommended a pproach for temperature data collection. o a7 hex + ssss hex : single te mperature measurement for which the configuration registe r (gain, adc, offset, etc.) will be loaded as ssss hex and must be provided externally via the interface. the data composition of the temperature configuration register is similar to the bm_config (address 10 hex ) register for the bridge sensor. 3.7.3. calibration step 3 C coefficient calculations the math to perform the coefficient calculation is complicated and will not be discussed in detail. there is a brief overview in the next section. zmdi will provide software (dlls) to perform the coefficient calculation (external to the s ensor - ic system) based on auto - zero correc ted v alues. after the coefficients are calculated, the final step is to write them to the mtp memory of the zssc 3036 . 3.8. the calibration math 3.8.1. bridge signal compensation the saturation check in the zssc 3036 is enhanced compared with older sscs from zmdi. even saturation effects of the internal calculation steps are detected, allowing the final correction output to still be determined. it is possible to get potentially useful signal conditioning results which have had an intermediate saturation during the calcul ations C these cases are detectable by observing the status bit[0] for each measurement result. details about the saturation limits and the valid ranges for values are provided in the following equations. sot_curve selects whether second - order equations co mpensate for sensor nonlinearity with a parabolic or s - shaped curve. the parabolic compensation is recommended.
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 42 of 49 the correction formula for the differential signal reading is represented as a two - step process depending on the sot_curve setting. equations fo r the parabolic sot_curve setting ( sot_curve = 0): simplified: (5) (6) (7) ( delimited to positive number range) (8) ( delimited to positiv e number range) (9) complete: (10) (11) (12) (13) (14) setl t raw t t ? ? ? _ ? ? ? ? ? ? ? ? ? ? ? ? ? tcg t tcg sot t k 15 15 15 1 2 _ 2 2 ? ? ? ? ? ? ? ? ? ? ? ? ? ? tco t tco sot t raw br b offset k 15 15 2 2 _ 2 _ _ 15 2 15 1 15 2 2 2 _ ? ? ? ? k k b gain z bp ? ? ? ? ? ? ? ? ? ? 15 15 15 2 2 _ 2 bp bp z bridge sot z b ? ? 1 2 2 17 17 _ ? ? ? ? ? setl t raw t t 1 2 2 1 2 2 1 2 2 1 2 2 15 15 15 1 17 17 17 17 17 17 17 17 2 _ 2 2 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? tcg t tcg sot t k 1 2 2 1 2 2 1 2 2 1 2 2 1 2 2 15 15 2 17 17 17 17 17 17 17 17 17 17 2 _ 2 _ _ ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? tco t tco sot t raw br b offset k 1 2 0 15 1 2 2 1 2 2 2 15 1 15 17 17 17 17 17 2 2 2 _ ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? k k b gain z bp 1 2 0 1 2 2 15 1 2 2 15 15 16 17 17 17 17 2 2 _ 2 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? bp bp z bridge sot z b
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 43 of 49 equations for the s - shaped sot_curve setting ( sot_curve = 1): simplified: (15) ( delimit ed to positive number range) (16) complete: (17) (18) where b = corrected bridge reading output via i 2 c ? or spi; range [0 hex to ffff hex ]; br_raw = raw bridge reading from adc after az correction; range [ - 1ffff hex to 1ffff hex ]; gain _b = bridge gain term; range [ - 1ffff hex to 1ffff hex ]; offset _b = bridge offset term; range [ - 1ffff hex to 1ffff hex ]; tcg = temperature coefficient gain term; range [ - 1ffff hex to 1ffff hex ]; tco = temperature coefficient offset term; range [ - 1ffff hex to 1ffff hex ]; t_raw = raw temperature reading after az correction; range [ - 1ffff hex to 1ffff hex ]; t setl = t_raw reading at which low calibration was performed (e.g. , 25c); range [ - ffff hex to ffff hex ]; sot _tcg = second - order term for tcg non - linearity; range [ - 1ffff hex to 1ffff hex ]; sot _tco = second - order term for tco non - linearity; range [ - 1ffff hex to 1ffff hex ]; sot_bridge = second - order term for bridge non - linearity; range [ - 1ffff hex t o 1ffff hex ]; = absolute value = bound /saturation number range from ll to ul , over/under - flow is report ed as saturation in status byte. 2 15 1 15 2 2 _ k k b gain z bs ? ? ? 15 15 15 15 2 2 2 _ 2 ? ? ? ? ? ? ? ? ? ? ? bs bs z bridge sot z b 1 2 2 1 2 2 2 15 1 15 17 17 17 17 2 2 _ ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? k k b gain z bs 16 17 17 17 17 17 17 2 0 15 1 2 2 1 2 2 15 1 2 2 15 15 2 2 2 _ 2 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? bs bs z bridge sot z b ? ? ? ul ll ?
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 44 of 49 3.8.2. temperature signal compensation temperature is measured internally. temp erature correction contains bot h linear gain and offset terms as well as a second - order term to correct for any nonlinearities. for temperature, second - order compensation for nonlinearity is always parabolic. again, the correction formula is best represent ed as a two - step process as follows: simplified: ( delimit ed to positive number range) (19) ( delimit ed to positive number range) (20) complete: (21) (22) where gain_t = gain coefficient for temperature; range [ - 1ffff hex to 1ffff hex ]; t_raw = raw temperature reading after az correction; range [ - 1ffff hex to 1ffff hex ]; offset_t = offset coefficient for temperature; range [ - 1ffff hex to 1ffff hex ]; sot_t = second - order term for temperature source non - linearity; range [ - 1ffff hex to 1ffff hex ] ? ? 15 15 2 _ _ 2 _ ? ? ? ? t offset raw t t gain z t ? ? ? ? ? ? ? ? ? ? 15 15 15 2 2 _ 2 t t z t sot z t ? ? 1 2 0 15 1 2 2 1 2 2 15 17 17 17 17 17 2 _ _ 2 _ ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? t offset raw t t gain z t 1 2 0 1 2 2 15 1 2 2 15 15 16 17 17 17 17 2 2 _ 2 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? t t z t sot z t
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 45 of 49 4 die dimensions and p ad assignments t he zssc 3036 is available in die form with chip size (inclu ding scribe line) of 1.5mm 2 . s ee figure 4 . 1 fo r additional dimensions . in figure 4 . 1 , t he outer dimensions shown are estimations for a die after sawing with remaining scribe - line silicon of approximately 20 m around the core die. thus, the effective outer dime nsions m ight differ slightly. figure 4 . 1 zssc 3036 pad placemen t
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 46 of 49 table 4 . 1 die size & geometry parameter min [ m] typ [ m] description / remarks x - dimension 900 925 i nclud es seal ring and remaining empty silicon after saw - ing; maximum dimensions may be larger for engineering samples due to wider scribe lines y - dimension 1560 1585 bondpad size (x & y) 79.5 80 p assivation window opening effective area for bond connection 60 60 v alid only for two special pads: vdd2 and eoc2 being shorted with vdd and eoc, respectively minimum pitch for application relevant pads 200 - center - to - center distance; there are additional pads, which are only for zmdis test purp oses die size adder beyond seal ring 0 40 p otentially remaining silicon after die sawing sawing lane 80 - die to die distance table 4 . 2 pin assignments name direction type description vdd1 in supply ic pos itive supply voltage for the ic, regular bond pad vdd2 ic positive supply voltage for the ic, special pad (electrically connected to vdd1, also bondable) vss in supply ground reference voltage signal vssb out analog negative bridge supply (bridge sen sor ground) vddb out analog positive bridge supply inp in analog positive bridge signal inn in analog negative bridge signal eoc1 out digital end of conversion, regular bond pad eoc2 end of conversion, special pad (electrically connected to eoc1, al so bondable) sel in digital i2c ? or spi interface select sclk/scl in digital clock input for i2c ? /spi mosi/sda in/out digital data input for spi; data in/out for i2c ? miso out digital data output for spi ss in digital slave select for spi zmdi - test - - do not connect to these pads 5 quality and reliability the zssc 3036 is available i n s tandard and e xtended qualifi c ation ic version s . for the s tandard version zssc3036 c c xxx , all data specified parameters are guaranteed if not stated otherwise. for the extended qualification version zssc3036c i xxx, t h ere is a l so specific testing in order to sort for ic - specific (htol - qualified) early failures .
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 47 of 49 6 ordering sale s codes sales code description package zssc3036cc1b die temperature range: C 40c to +85 c wafer (304m) unsawn, tested zssc3036cc6b die temperature range: C 40c to +85 c wafer ( 725 m) unsawn, tested zssc3036ci1b die temperature range: C 40c to +85 c, extended qualification wafer (304m) unsawn, tested zssc3036ci 6 b die temperature range: C 40c to +85 c, extended qualification wafer ( 725 m) unsawn, tested zssc3036cc1c die temperature range: C 40c to +85c dice on frame (304m), tested zssc3036cc1 d die temperature range: C 40c to +85c waffle pack (304m), tested zssc3036c i 1c die temperature range: C 40c to +85c, extended qualification dice on frame (304m), tested zssc3036c i 1d die temperature range: C 40c to +85c, extended qualification waffle pack (304m), tested ZSSC3036CI1BH die temperature range: C 40c to +110 c, 1 extended qualification wafer (304m) unsawn, tested zssc3036ci 6 bh die temperature range: C 40c to +110 c, e xtended qualification wafer ( 725 m ) unsawn, tested zssc3036ci1 ch die temperature range: C 40c to +110 c, e xtended qualification dice on frame (304m), tested zssc30x6 - kit evaluation kit for zssc30x6 product family, including boards, cable, software, and 1 sample kit contact zmdi sales for additional informatio n. 7 related documents document file name zssc 3036 feature sheet zssc 3036 _featuresheet_v*.pdf zssc 3036 application note: application circuits zssc 3036 _applicationcircuit_v*.pdf zssc30x6 evaluation kit documentation zssc30x6_evaluationkit_v*.pdf zssc30x6 application note: calibration zssc30x6_calibration_v*.pdf visit zmdis website www.zmdi.com or contact your nearest sales office for ordering information or the latest version of these documents.
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 48 of 49 8 glossary term descri ption a2d analog - to - d igital ack acknowledge ( interfaces protocol indicator for successful data/command transfer) adc analog - to - d igital c onverter or c onversion az auto - zero (unspecific) a z b auto - zero measurement for s ensor b ridge p ath azt auto - zero measurement for t emperature p ath clk clock dac digital - to - analog c onversion or c onverter df data fetch (this is a command type) dsp digital s ignal p rocessor (digital configuration, calibration, calculation, communication unit) fso full scale output (v alue in percent relative to the adc maximum output code; resolution dependent) lsb least s ignificant b it (fine portion of the converted signal) lfsr linear feedback shift register mr measurement request (this is a command type) msb m ost significant b it (coarse portion of the converted signal) nack not acknowledge ( interfaces protocol indicator for unsuccessful data/command transfer) por power - on r eset preamp pre amplifier sm signal m easurement sot second - o rder t erm tc temperature c oefficient ( of a resistor or the equivalent bridge resistance) tm temperature m easurement
z ssc3036 low - power 16 - bit sensor signal conditioner ic data sheet may 28 , 20 13 ? 201 3 zentrum mikroelektronik dresden ag r ev. 1 .20 all rights reserved. the material contained herein may not be reproduced, adapted, merged, translated, stored, or used withou t the prior written consent of the copyright owner. the information furnished in this publicatio n is subject to changes wi thout notice. 49 of 49 9 document revision history revision date description 1.00 j une 12 , 201 2 first release of data sheet 1.10 january 22, 2013 corrected measurement duration values, new contact in formation table 1.20 may 2 8 , 2013 revision update for contact information and imagery for cover and headers. sales and further information www.zmdi.com mobile.sensing@zmdi .com zentrum mikroelektronik dresden ag global headquarters grenzstrasse 28 01109 dresden, germany central office: phone +49.351.8822.0 fax +49.351.8822.600 zmd america, inc. 1525 mccarthy blvd., #212 milpitas, ca 95035 - 7453 usa usa phone +855.275.9634 zentrum mikroelektronik dresden ag, japan office 2nd floor, shinbashi tokyu bldg. 4 - 21 - 3, shinbashi, minato - ku tokyo, 105 - 0004 japan zmd far east, ltd. 3f, no. 51, sec. 2, keelung road 11052 taipei taiwan zentrum mikroelektronik dresden ag, korea office u - space 1 building 11th floor, unit ja - 1102 670 sampyeong - dong bundang - gu, seongnam - si gyeonggi - do, 463 - 400 korea phone +82.31.950.7679 fax +82.504.841.3026 phone +408.883.6310 fax +408.883.6358 phone +81.3.6895.7410 fax +81.3.6895.7301 phone +886.2.237 7.8189 fax +886.2.2377.8199 european technical support phone +49.351.8822.7.772 fax +49.351.8822.87.772 disclaimer : this information applies to a product under development. its characteristics and specifications are subject to change witho ut notice. zen trum mikroelek tronik dresden ag (zmd ag) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. the information furnished hereby is believed to be true and accurate. however, under no circumstances shall zmd ag be liable to any customer, licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature what soever arising out of or in any way related to the furnishing, performance, or use of this technical data. zmd ag hereby expressly disclaims any liability of zmd ag to any customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liab ility of zmd ag for any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty, tort (including negligence), strict liability, or otherwise. european sales (stuttgart) phone +49.711.674517.55 fax +49.711.674517.87955

▲Up To Search▲

Price & Availability of ZSSC3036CI1BH

	To Download ZSSC3036CI1BH Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .